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15/182,744 | 5649-4474:

METHODS OF FORMING THIN FILMS AND METHODS OF FABRICATING INTEGRATED CIRCUIT DEVICES USING THE SAME

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Application #

15/182,744

Confirmation #

1021

Attorney Docket #

5649-4474

Patent #

9,960,032open_in_new
Download PDFdownload  Textdownload Issued - 05/01/2018

Filing or 371 (c) date

06/15/2016

Status

Patented Case 04/11/2018

Application data

Application type

Utility

Examiner

SELIM U AHMED

Group art unit

2816

Class/subclass

438/283.000

AIA (first inventor to file)

Yes

Entity status

Regular Undiscounted

Earliest publication #

US 2017-0062205 A1open_in_new Download PDFdownload  Textdownload

Earliest publication date

03/02/2017

Assignee for publication
-
Confirmation #
    1021
Intl. registration # (Hague)

-

Intl. registration publication date

-

Correspondence address
140486 - MYERS BIGEL, P.A.
4130 Parklake Avenue
Suite 250
RALEIGH, NC 
UNITED STATES
Inventors
  • Jae wan Chang
    Seoul (KR)
  • Youn soo Kim
    Yongin-si (KR)
  • Tsubasa Shiratori
    Suwon-si (KR)
Applicants
  • Samsung Electronics Co., Ltd.
    Suwon-si (KR)
  • Adeka Corporation
    Jeollabuk-do (KR)